Nokia 7610. Wont power up

[adampeake]

Hi all,

I have a Nokia 7610 here that is immaculate. No signs of damage, liquid damage, infact not even scratched.

The phone won't power up at all. When connected to my Twister box the phone wont allow me to flash or do anything to it. I get the following error:

1st Boot Ok, WD2, UPP: 1081
2nd Boot Error: 6
Platform: 6, Error Data:
E3 72 72 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
Process Failed, Repowering Mobile


Is this another Flash IC reflow? The box is working fine on other phones.

Thanks

Adam

[Skater-Chris]

Yep it certainly looks like it. Probably best to give all the major IC's a reflow. Not the ones that are underfilled of course. Lotsa flux too! Hope that helps.

Chris.

[adampeake]

Thanks SC..

By underfilled you mean the black sealant on things like the UEM? The two flash IC's on this phone will need liquid flux injecting under them and then i reckon 180-200c for a few seconds.

I am just getting into this level of hardware repair, and reccomendations on flux, tooling etc?

Comments appreciated.

Adam

[electrophoretic]

yeah reflowing is fun... you have to learn how to do it as you go along, its not easy but here we go...

you should start on a low temp first flow a BGA for a few seconds 20 - 30... now this is where i tell you my method, there are other ways of doing this so find your own that your comfy with...

when i am holding the air over a BGA I use a small pair of tweezers to GENTLY touch the edge of the BGA to see if it moves, this tells me that its flowed totally... now a lot of people will say that you will wreck a BGA this way and they are right, if you push the BGA too much it will "Jump" onto another set of balls... anyway

after the BGA is flowed take the heat off and leave to cool...

if your BGA doesnt flow within 60 seconds, remove the heat and turn up the temperature a bit and do it again!! hold the heat about 2cm above the BGA and rotate the heat around instead of holding it on one spot also...

anything else just ask!!!

G

[Skater-Chris]

I use a similar technique to Electro's and i make sure the air flow is very low. High air flow can blow the chip around or even blow components near the chip off the board (which i unfortunately experienced wen learning to reflow IC's).

As far as flux is concerned i use a no clean flux pen from Maplin Electronics. Its got a fairly fine tip which is good at getting the flux under the chip.
I apply it untill you can just see it around all edges of the chip. No clean flux is handy if you dont want to have to clean the board every time you reflow a chip. It doesnt conduct either so its very useful.

Hope this helps a bit.

Chris.