View Full Version : How to repair damage soldering contact point for the BGA IC?
Hi to all,
Have this problem of damaging the soldering contact point(the copper contact grid) on the board when changing the ccount or hanger IC.
Anyone have any suggestion on how to repair this?
thanks.
markchee
25-10-2002, 05:52 PM
Originally posted by dio
Hi to all,
Have this problem of damaging the soldering contact point(the copper contact grid) on the board when changing the ccount or hanger IC.
Anyone have any suggestion on how to repair this?
thanks.
Hello,dio
Theres some words need to correct you if not someone out there will mistaken.CCONT,not ccount/HAGAR,not hanger.Please correct me if Im wrong,thank you.
sincerely
mark
thiana
28-10-2002, 10:10 PM
u need a stamp bga grid, special soldering flux to make recomposition and a good hand on the hakko to hot it up....
wesam
29-10-2002, 11:09 AM
hi
see this
http://www.impextrom.com/video.htm
goodluck
wesam
thiana
29-10-2002, 05:13 PM
thanks for the video wesam. itīs a great one.
Originally posted by wesam
hi
see this
http://www.impextrom.com/video.htm
goodluck
wesam
Thanks for the video, but not in english cannot understand it full.
any chance that there is a English version
wesam
30-10-2002, 01:06 AM
hi
sorry dio i havent english one but i will try to find one or translate it
wesam
thiana
13-12-2002, 06:04 PM
Hello wesan. I went to impextrom once again to see that video, but itīs not there anymore. Can u help again?Thank you.
Mrhazeem
23-12-2002, 08:21 PM
There is a totorial at www.mobile-tech.net
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